Happening Now
Monday, October 7- NVIDIA CEO Jensen Huang to Deliver CES 2025 Keynote
- Inflection AI and Intel Launch Enterprise AI System
- Supermicro Unveils Complete Data Center Liquid Cooling Solution for AI and HPC Workloads
- Credo AI Unveils Its Integrations Hub, Connecting the Enterprise Tech Stack with Seamless AI Governance
- Dataiku Launches LLM Guard Services for Enhanced GenAI Cost, Quality, and Safety
- Microsoft Launches Azure VMs Optimized for AI Supercomputing, the ND H200 V5 Series
- GIGABYTE Announces General Availability of AmpereOne Servers for Cloud-Native Workloads
- Supermicro and Fujitsu Partner to Develop Green AI Computing Tech and Liquid-Cooling Solutions
- Cirrascale Powers AI and HPC Advancements with NVIDIA HGX H200 Server Integration
- HPC-AI Tech Raises $50M to Expand Colossal-AI and Open-Sora AI Platforms
- VAST Data Partners with Industry Leaders for Cosmos AI Ecosystem Launch
- MOSTLY AI Launches Synthetic Text to Overcome AI Training Plateau and Unlock High-Value Proprietary Data
- IBM Expands AI and HPC Offerings with NVIDIA H100 GPUs on IBM Cloud
- Anyscale Unveils New Products and Enhances Unified AI Platform at Ray Summit 2024
- DOE ASCR: Bringing FAIR Principles to AI Models
- D-Wave Partners with JT Pharma for Quantum-Enhanced Drug Discovery Project
- Cerebras Systems Announces Filing of Registration Statement for Proposed Initial Public Offering
- Fujitsu Expands GenAI Services with Takane LLM, Optimized for Enterprise and Japanese Language
- Alphawave Semi and TSMC Collaborate on 3nm UCIe Die-to-Die Subsystem for AI and HPC
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Kevin JacksonManaging Editor
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Douglas EadlineContributing Editor
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HBM3E
SK hynix Begins Mass Production of 12-Layer HBM3E
SEOUL, Sept. 27, 2024 -- SK hynix Inc. has announced that it has begun mass production of the world's first 12-layer HBM3E product with 36GB, the largest capacity of ...Full Article